Strain engineered electronic devices 



  • New approach for strain engineering

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  •                점 Current strain engineering methods have several drawbacks: they generate atomic defects
  •                  in the interface between Si and strain inducers. We developed the formation of a strained
  •                  semiconductor membrane with oxidation-induced residual strain by releasing a host mother
  •                  substrate of wafer.




  •          Device applications using strain engineering techinque 

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  •                점 We demonstrated the improved performance in the thin Si TFTs, MTJs on a flexible substrate 
  •                 by strain engineering without relying on the epitaxial stressor. This process can be applicable
  •                 for various flexible electronic devices. This approach shows promise for strain-engineered
  •                 large-area flexible electronics with high performance and productivity.