Most Cited Papers

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  Roll-to-roll production of 30-inch graphene films for transparent electrodes
   
  The outstanding electrical, mechanical, and chemical properties of graphene make it attractive for applications in flexible electronics. We reported the roll-to-roll production and wet-chemical doping of predominantly monolayer 30-inch graphene films grown by chemical vapor deposition onto flexible copper substrates
   
 

Cited by 6896

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  Stretchable and Foldable Silicon Integrated Circuits
   
  We have developed a simple approach to high-performance, stretchable, and foldable integrated circuits. The systems integrate inorganic electronic materials, including aligned arrays of nanoribbons of single crystalline silicon, with ultrathin plastic and elastomeric substrates. The designs combine multilayer neutral mechanical plane layouts and “wavy” structural configurations in silicon complementary logic gates, ring oscillators, and differential amplifiers.
   
 

Cited by 1256

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  Wafer-Scale Synthesis and Transfer of Graphene Films
   
  We developed means to produce wafer scale, high-quality graphene films as large as 3 in. wafer size on Ni and Cu films under ambient pressure and transfer them onto arbitrary substrates through instantaneous etching of metal layers. We also demonstrated the applications of the large-area graphene films for the batch fabrication of field-effect transistor (FET) arrays and stretchable strain gauges showing extraordinary performances.
   
 

Cited by 1042

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  Extremely efficient flexible organic light-emitting diodes with modified graphene anode
   
  Although graphene films have a strong potential to replace indium tin oxide anodes in organic light-emitting diodes (OLEDs), to date, the luminous efficiency of OLEDs with graphene anodes has been limited by a lack of efficient methods to improve the low work function and reduce the sheet resistance of graphene films to the levels required for electrodes
   
 

Cited by 1003

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  Heterogeneous Three-Dimensional Electronics by Use of Printed Semiconductor Nanomaterials
   
  Repeated application of an additive, transfer printing process that uses soft stamps with these substrates as donors, followed by device and interconnect formation, yields high-performance heterogeneously integrated electronics that incorporate any combination of semiconductor nanomaterials on rigid or flexible device substrates. This versatile methodology can produce a wide range of unusual electronic systems that would be impossible to achieve with other techniques.
   
 

Cited by 697

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